Temasek has upsized its bond offering to $500 million from its initial offering of $350 million.

On Nov 15, Temasek proposed to offer new five-year bonds under Temasek Financial (IV)’s $5 billion guaranteed medium term note programme.

See: Temasek Holdings offers new five-year bonds; public offer tranche to open to retail investors

The bonds, which will be listed on the SGX-ST, will mature in 2026.

The upsized offering comprises a final public offer size of $250 million for retail investors, $150 million more than the initial public offer size.

The final placement size of $250 million for institutional, accredited and other specified investors remains the same.

On Nov 22, Temasek announced that its retail tranche of $100 million drew total valid applications amounting to $649.5 million, about 2.6 times based on the final public offer size of $250 million, or 6.5 times the initial public offer size of $100 million.

See also: Temasek's bond offering with $100 mil retail tranche drew $649.5 mil in total application

The bond is expected to be issued on Nov 24 and commence trading on the SGX-ST Mainboard at 9am on Nov 25.

The SGX-ST stock code for the bonds will be TEMB.

Photo: Bloomberg