STATS ChipPAC today opened its new 300mm embedded Wafer-Level Ball Grid Array (eWLB) manufacturing facility in Yishun.

In April, STATS ChipPAC became the first in the world to implement 300mm eWLB wafer manufacturing capabilities and has shipped over 35 million eWLB units to date.

The transition from 200mm to 300mm eWLB wafer manufacturing provides STATS ChipPAC and its customers with a number of cost and productivity benefits such as higher efficiency and economies of scale as compared to the existing 200mm eWLB reconstituted wafer format.

STATS ChipPAC’s initial investment in eWLB technology totals more than US$100 million ($133.6 million).