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Singapore’s STATS ChipPAC (STTS.SI) plans to issue US$600 million ($816 million) of 5-year bonds this week after a series of meetings with investors, a source close to the deal said on Monday.
The firm will meet investors in Singapore starting on Monday, then in Hong Kong on Tuesday and London on Wednesday, the source said. It will also hold a roadshow simultaneously in the United States, the source added.
The firm will meet investors in Singapore starting on Monday, then in Hong Kong on Tuesday and London on Wednesday, the source said. It will also hold a roadshow simultaneously in the United States, the source added.
Credit Suisse (CSGN.VX) and Deutsche Bank (DBKGn.DE) were hired to arrange the roadshow and manage the deal, the source said.
STATS ChipPAC, a leading service provider of semiconductor packaging design, assembly, among others, earlier said it planned to buy back its debt due in 2011.
